At Mobile World Congress (MWC) 2026, Forefront RF what it believes to be the industry’s first commercially available tunable duplexer module, the FFM51010, implemented without SAW or BAW acoustic filtering.
Skyworks Solutions, Inc. announced it will showcase an early 6G new FR3 frequency range RF front-end (RFFE) power amplifier at Mobile World Congress 2026.
Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17, iPhone 17 Pro and iPhone 17 Pro Max relies on fully depleted silicon-on-insulator (FD-SOI) substrate technology.
Sivers Semiconductors AB announced its participation at MWC Barcelona, March 2–5, 2026.
Ericsson and Intel are pooling their next-generation technology leadership to help accelerate ecosystem readiness for seamless transition to AI-native 6G deployments and use cases.
Guerrilla RF, Inc. announced its expanded focus and readiness to support the rapidly evolving unmanned aerial systems (UAS) and counter-UAS (C-UAS) markets.
Viasat and Rohde & Schwarz are working together to strengthen and expand testing for non‑terrestrial network (NTN) capabilities, specifically for NB-IoT devices.
Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio.
Spectrum Control introduces the PulseShield™ Transportable HEMP Filter Series of compact, lightweight high-altitude electromagnetic pulse (HEMP) filters.
At Enforce Tac 2026, Aaronia AG demonstrated how its AARTOS DDS platform addresses these evolving threats through a fully integrated approach to detection, analysis and electronic warfare.
Ericsson announced a successful live proof of concept of its integrated sensing and communication (ISAC) technology at the company’s U.S. Headquarters in Plano, Texas, signaling a major step forward in the evolution of networks that both connect and sense the world around them.
Amphenol RF has expanded their precision adapter portfolio with an additional 2.4 mm adapter designed for use in laboratory and production test environments.
Celeste Technologies announced the successful completion of a 5G NR-non-terrestrial networks (NTN) interoperability test campaign at the Qualcomm Technologies, Inc. laboratories in Lannion, France, marking a significant milestone with Sateliot's Payload for the sovereign European low-Earth orbit (LEO) direct-to-device (D2D) constellation.
Gilat Satellite Networks Ltd. announced the successful demonstration of 3GPP-compliant 5G non-terrestrial network (NTN) connectivity over a GEO satellite.
NTT DOCOMO, INC. and Keio University Haptics Research Center announced that they have successfully conducted a demonstration of high-precision remote robot operation over commercial 5G.
Airbus Defence and Space and Greenerwave announce the strengthening of their strategic partnership with the signing of two additional contracts with a total value of several million euros.
Rohde & Schwarz and LITEON collaborate to showcase a production-optimized test setup for high-throughput multi-device testing at MWC Barcelona 2026.
Amphenol Printed Circuits (APC) will be attending and exhibiting at the American Physical Society’s APS Global Physics Summit 2026, March 15-20, 2026 in Denver, Colo.
Samtec’s rugged high-density, high performance interconnects and alignment products were selected for the VITA 90 standard for use on both the plug-in module (PIM) and the backplane enabling a SWaP alternative to 3U OpenVPX.
Amphenol RF introduced 2.92 mm connectors engineered to accommodate 0.141 in. conformable cable enabling stable, low loss high frequency test and instrumentation usage.