Groundbreaking research is underway at Northrop Grumman’s Microelectronics Center (NGMC) which is reshaping physicists’ understanding of diamonds, positioning them as the next-generation material used in manufacturing microelectronics.
Reactel looks forward to exhibiting at the International Microwave Symposium (IMS), held this year in Boston, Mass., from June 7-12, 2026.
IBL Lab GmbH, the DAkkS-accredited EMC test laboratory of IB Lenhardt AG, has significantly expanded its high-field immunity testing capabilities with a substantial investment in a suite of high-power amplifier systems from Rohde & Schwarz.
Global Invacom Group and Satwave Arrays Inc. signed a Memorandum of Understanding (MoU) to enable the commercial production of a multi-orbit flat panel antenna (FPA) for Ka/Ku-Band.
NexSat Space Systems Corporation announced its official company launch and unveiled its first groundbreaking product development, ACE (Aero Conformal ESA) — an industry-first fully integrated Ku/Ka-Band electronically steered antenna (ESA), known as “The Invisible Antenna.”
The 3GPP Organizational Partners, the Telecommunication Technology Committee and the Association of Radio Industries and Businesses, were joint hosts of the 3GPP Technical Specification Group (TSG) #111 meetings, held in Fukuoka from March 9 to 13, 2026. Although 5G Advanced specification work remains the primary focus, two new reports caught the eye during the week.
Open Cosmos unveils its new global space-based IoT service — the only offering to fuse global IoT connectivity with real-time Earth observation data to deliver contextual intelligence to governments and institutions across the world.
Kymeta Corporation reveals specifications for its first multi-band, multi-orbit, single aperture antenna – as part of a revolutionary new user terminal set to make other satcom technologies secondary when mission comes first.
CML Micro is showcasing its satellite communications semiconductor portfolio at SATShow 2026 for the first time.
Guerrilla RF, Inc. announced its expanded focus and readiness to support the rapidly evolving satcom market.
Tethon 3D announced the acquisition of a strategic portfolio of intellectual property assets that will expand the company’s capabilities in advanced materials and technical ceramics.
Teledyne Technologies Inc. will showcase its integrated satellite communications capabilities at SATShow Week 2026
Airspan Networks and ATIKA announced a strategic alliance to advance resilient, multi-domain 5G connectivity solutions for military operations.
NEC Corporation will develop a small technology demonstration satellite to conduct in-orbit verification of key technologies essential for realizing future optical communication satellite constellations, including optical communications, high speed network routing design and high-capacity mmWave band communications.
SWISSto12 announced the inauguration of its largest-ever cleanroom, a 1,000m² purpose-built assembly facility for the industrial-scale production of its HummingSat satellite.
Microsembly announced that it will exhibit at SATELLITE 2026 (SATShow Week) from March 23 — 26 in Washington, D.C., at the Walter E. Washington Convention Center (Booth 2159).
Ericsson and SK Telecom announced the signing of a Memorandum of Understanding (MoU) to strengthen their collaboration on mobile network technologies spanning 5G to future 6G.
Electro-Photonics LLC announced that the company has acquired ELECTRONICS COMPONENTS UK LTD, marking an important step in expanding their presence across Europe.
Pickering Interface will showcase its HIL sensor simulation demo, alongside its recently released graphical software design tool for signal switching and cabling systems, Test System Architect, on stand #2459 in Exhibit Hall A & B at the upcoming SATShow Week 2026
ELVA-1 has reported a rise in demand for solid-state noise sources capable of supporting measurement and calibration at mmWave and sub-terahertz frequencies, pointing to the rapid expansion of high frequency research across both academic and industrial sectors.