Industry News
Silex Announces First 12-inch Wafer Fab for Pure-Play MEMS Manufacturing
Advancements in Wireless Communication Technologies and Automotive Electronics Driving the RF Filter Market
Reticulate Micro Introduces Ku/Ka-Band Electronically Steerable Antenna for SATCOM Terminals
Trending IoT Products in 2024: April Edition
Raytheon Awarded $344M Contract to Modernize Electronics Unit for Missile Development Program
Raytheon has been awarded a $344 million contract for the development of two missile variants – the SM-2 Block IIICU and SM-6 Block IU – which will be based on a common guidance section, where the electronics and software that guide a missile to its target are housed.
Hughes Opens State-of-the-art Manufacturing Facility and Private 5G Incubation Center in Maryland
Hughes Network Systems, LLCannounced the opening of a new cutting-edge manufacturing facility and private 5G incubation center in Germantown, Md.
Radar Innovation: A Bright Future
Yole Group has combined its significant semiconductor expertise and deep knowledge of RF technologies and markets to deliver its annual report, "Status of the Radar Industry."
IoT Solutions World Congress 2024 to Take Place in Barcelona Next Month
CEA-Leti Chosen to Coordinate Two EU Projects for Developing 6G Capabilities and Standards
PPM Systems Enables 5x Increase in Detection Range of Observational Naval Antenna
u-blox Announces Multiple Wins in the Robotic Lawnmower Market with its High-Precision GNSS Technology
Uhnder Unveils New Cost-Effective 4D Imaging Radar Chip for ADAS Applications
Cadence and TSMC Collaborate on System and Semiconductor Design Innovations
Silex Announces the First Pure-Play MEMS 12 in. Wafer Fab
Silex announces the first 12 in. wafer fab for pure-play MEMS manufacturing. The new wafer fab will enable wafer level and monolithic integration of 12 in. wafer-based CMOS and MEMS.
Reticulate Micro Unveils VALOR™ ESA Product Line
Reticulate Micro announced its disruptive flat panel antenna product family, VALOR.
CEA-Leti Selected to Coordinate Two EU Projects for Developing 6G
As part of the EU’s drive to support a multifaceted approach to addressing 6G challenges and promises, CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.
Uhnder Releases New 4D Digital Imaging Radar Chip
Uhnder Inc. unveiled the commercial availability of its latest innovation, the S81 mass market imaging radar solution.