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Small Form Factor CDM Testing, Part 3

2 weeks 5 days ago

Small form factor devices often fail traditional field‑induced CDM testing, prompting the need for contact‑first methods. This article compares CC‑TLP, low‑impedance contact CDM, and relay‑based CDM techniques, outlining how each provides more repeatable, lower‑noise stress conditions for bare die and wafer‑level testing.

The post Small Form Factor CDM Testing, Part 3 appeared first on In Compliance Magazine.

Kathleen Muhonen

Impact of PCB Via and Trace Geometry on the Effectiveness of Decoupling Capacitors, Part 2

2 weeks 5 days ago

Conducted emissions testing on custom PCBs shows how moving a decoupling capacitor farther from an IC can increase emissions across multiple frequency bands. Using CISPR 25 methods, this study compares capacitor placements and via topologies to reveal how distance and inductance shape PDN behavior.

The post Impact of PCB Via and Trace Geometry on the Effectiveness of Decoupling Capacitors, Part 2 appeared first on In Compliance Magazine.

Bogdan Adamczyk