Industry News Latest

Amphenol RF introduced new MMCX straight and right-angle plug cable assembly configurations designed on flexible RG-316 cable into their pre-configured cable assembly portfolio. 

DesignCon has announced the keynote speakers for the 2026 edition.

Ericsson announced a major joint Microsoft-Ericsson development in enterprise mobility — the integration of advanced 5G capabilities directly into Windows 11. 

KRYTAR, Inc, announces a new two-way power divider offering high performance over the broadband frequency range of 7.0 to 24.0 GHz in a compact package.

Raytheon was awarded a contract from the Air Force Research Laboratory to develop a domestic production capability for thin film lithium niobate (TFLN) wafers, a material essential to high speed, secure communications and advanced sensing systems.

According to a recently published report from Dell’Oro Group, preliminary findings reveal that the RAN market ended the year on a stable note, with stronger than typical 3Q to 4Q seasonality.

Sivers Semiconductors AB announced general availability of its Cloudchaser beamforming chipset and Maverick antenna-array panels for Ka-Band satcom ground terminals.

Taoglas will introduce the world’s first AI-driven Antenna Product Recommendation Engine at embedded world 2026 in Nuremberg, Germany (March 10-12).

PLD Space and Sateliot have signed a commercial contract to launch their first two high-capacity 5G direct-to-device (D2D) satellites. 

The annual RF and Microwave Design Seminar, taking place November 5 at the Møller Institute at Churchill College, features eight high-quality technical presentations from leading industry experts and a small commercial exhibition.